SSOP/TSSOP28 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm/5.3-5.7mm
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SSOP/TSSOP28 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm/5.3-5.7mm
SSOP/TSSOP28 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm/5.3-5.7mm_1
S0P28_.65mm_toDIP5.3-5.7mm_2

SSOP/TSSOP28 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm/5.3-5.7mm

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  • Product SKU: KG907
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Specification

Description

The SSOP/TSSOP28 Burn DIP Test Seat Patch IC Chip Adapter is designed to simplify the testing and integration of SSOP28 and TSSOP28 (Shrink Small Outline Package/Thin Shrink Small Outline Package) IC chips into existing circuit designs. With a pitch of 0.65mm and a body width of 5.3-5.7mm, this adapter offers a practical solution for testing and prototyping electronic circuits, ensuring compatibility and ease of use without requiring extensive redesign.

Features:

Wide Compatibility: Compatible with SSOP28 and TSSOP28 IC chips, expanding the range of compatible components for your project.

Pin Pitch Conversion: Converts the pin configuration of SSOP28 and TSSOP28 packages to fit the standard 0.65mm pitch of DIP footprints on PCBs.

Body Width Compatibility: Accommodates IC chips with a body width of 5.3-5.7mm, ensuring a secure fit during testing and integration.

Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.

Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.

Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.

Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.

Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.

Enhanced Connectivity: Provides reliable connections between the SSOP28 or TSSOP28 package and the DIP footprint, ensuring stable performance during testing and operation.

Applications:

IC chip testing and prototyping.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.

Specifications


S.No. Item PCB Size(mm) Pitch (mm) Pin Count Width(mm)
1 TSSOP/SSOP8 (4.4mm) 36*23 0.65 8 4.4
2 TSSOP/SSOP14 (4.4mm) 36*23 0.65 14 4.4
3 TSSOP/SSOP16 (4.4mm) 36*23 0.65 16 4.4
4 TSSOP/SSOP20 (4.4mm) 36*23 0.65 20 4.4
5 TSSOP/SSOP24 (4.4mm) 36*23 0.65 24 4.4
6 TSSOP/SSOP28 (4.4mm) 36*23 0.65 28 4.4
7 TSSOP/SSOP20 (5.3-5.7mm) 42*24 0.65 20 5.3-5.7
8 TSSOP/SSOP24 (5.3-5.7mm) 42*24 0.65 24 5.3-5.7
9 TSSOP/SSOP28 (5.3-5.7mm) 42*24 0.65 24 5.3-5.7

Product Parameter

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Package Includes

  • 1 x SSOP/TSSOP28 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm/5.3-5.7mm

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