In-line DIP IC seat chip base PLCC32
![In-line DIP IC seat chip base PLCC32]()
![In-line DIP IC seat chip base PLCC32 front image]()
![In-line DIP IC seat chip base PLCC32 front and back image]()
![In-line DIP IC seat chip base PLCC32]()
![In-line DIP IC seat chip base PLCC32 front image]()
![In-line DIP IC seat chip base PLCC32 front and back image]()
DIP IC seat: This refers to the part of the component designed to hold or accommodate a DIP IC. DIP is a common package type for integrated circuits, and "IC seat" suggests a socket or receptacle for securely placing a DIP IC.
Chip base: This could imply the foundation or base of the component that interfaces with the DIP IC. It's the part that physically supports and connects to the DIP IC.
-29%
In-line DIP IC seat chip base PLCC32
Available:In Stock
- Product SKU: BASE037
₹ 99
₹ 140
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Specification
Description
The description "In-line DIP IC seat chip base PLCC32" suggests a component that serves as an adapter or socket for interfacing a DIP (Dual Inline Package) IC with a PLCC32 (Plastic Leaded Chip Carrier with 32 pins) footprint.Let's Break Down The Description:
In-line: This indicates that the component is designed in a linear or straight configuration. In the context of electronic components, "in-line" often means that the pins or connectors are aligned in a single row.DIP IC seat: This refers to the part of the component designed to hold or accommodate a DIP IC. DIP is a common package type for integrated circuits, and "IC seat" suggests a socket or receptacle for securely placing a DIP IC.
Chip base: This could imply the foundation or base of the component that interfaces with the DIP IC. It's the part that physically supports and connects to the DIP IC.
PLCC32:
This indicates the other end or side of the component designed for a PLCC32 footprint. PLCC32 is a specific type of chip carrier package with 32 pins arranged in a square or rectangular pattern.Technical Details
- Type: PLCC
- Number of poles or pins (grid): 32 (2 x 7, 2 x 9)
- Pitch - Mating: 0.050 inches (1.27mm)
- Contact Finish - Mating: Tin
- Contact finish thickness - mated: 150.0µin (3.81µm)
- Contact material - mating: Phosphor Bronze
- Mounting type: Surface mount
- Features: closed frame
- Termination: Solder
- Pitch - Post: 0.050 inches (1.27mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 150.0µin (3.81µm)
- Contact material - post: Phosphor Bronze
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -55°C to 125°
- Rated Current (A): 1A
- Contact Resistance: 20 milliohm
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