SSOP/TSSOP24 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm
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Pin Pitch Conversion: Converts the pin configuration of SSOP24 and TSSOP24 packages to fit the standard 0.65mm pitch of DIP footprints on PCBs.
Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.
Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.
Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.
Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.
Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.
Enhanced Connectivity: Provides reliable connections between the SSOP24 or TSSOP24 package and the DIP footprint, ensuring stable performance during testing and operation.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.
-37%
SSOP/TSSOP24 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm
Available:In Stock
- Product SKU: KG903
₹ 499
₹ 798
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Warehouse Details
Specification
Description
The SSOP/TSSOP24 Burn DIP Test Seat Patch IC Chip Adapter is designed to simplify the testing and integration of SSOP24 and TSSOP24 (Shrink Small Outline Package/Thin Shrink Small Outline Package) IC chips into existing circuit designs. This adapter provides a convenient solution for testing and prototyping electronic circuits, ensuring compatibility and ease of use without requiring extensive redesign.Features:
Wide Compatibility: Compatible with SSOP24 and TSSOP24 IC chips, expanding the range of compatible components for your project.Pin Pitch Conversion: Converts the pin configuration of SSOP24 and TSSOP24 packages to fit the standard 0.65mm pitch of DIP footprints on PCBs.
Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.
Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.
Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.
Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.
Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.
Enhanced Connectivity: Provides reliable connections between the SSOP24 or TSSOP24 package and the DIP footprint, ensuring stable performance during testing and operation.
Applications:
IC chip testing and prototyping.Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.
Specifications
| S.No. | Item | PCB Size(mm) | Pitch (mm) | Pin Count | Width(mm) |
|---|---|---|---|---|---|
| 1 | TSSOP/SSOP8 (4.4mm) | 36*23 | 0.65 | 8 | 4.4 |
| 2 | TSSOP/SSOP14 (4.4mm) | 36*23 | 0.65 | 14 | 4.4 |
| 3 | TSSOP/SSOP16 (4.4mm) | 36*23 | 0.65 | 16 | 4.4 |
| 4 | TSSOP/SSOP20 (4.4mm) | 36*23 | 0.65 | 20 | 4.4 |
| 5 | TSSOP/SSOP24 (4.4mm) | 36*23 | 0.65 | 24 | 4.4 |
| 6 | TSSOP/SSOP28 (4.4mm) | 36*23 | 0.65 | 28 | 4.4 |
| 7 | TSSOP/SSOP20 (5.3-5.7mm) | 42*24 | 0.65 | 20 | 5.3-5.7 |
| 8 | TSSOP/SSOP24 (5.3-5.7mm) | 42*24 | 0.65 | 24 | 5.3-5.7 |
| 9 | TSSOP/SSOP28 (5.3-5.7mm) | 42*24 | 0.65 | 24 | 5.3-5.7 |
Product Parameter
Product Video
Package Includes
- 1 x SSOP/TSSOP24 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm
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