SSOP/TSSOP8 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm
Review: 5 - "A masterpiece of literature" by John Doe, written onMay 4, 20020
Great
-44%
TSSOP/SSOP8 4.4mm Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm
TSSOP/SSOP8 4.4mm Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm_1
TSSOP/SSOP8 4.4mm Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm_2

SSOP/TSSOP8 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm

Available:Out of Stock
  • Product SKU: KG899
Wishlist
₹ 499 ₹ 899
Successful pre-order.Thanks for contacting us!
Secure

Specification

Description

This burn DIP test seat adapter is designed to facilitate the testing and integration of TSSOP8 and SSOP8 (Thin Shrink Small Outline Package/ Shrink Small Outline Package) IC chips into circuit designs. With a compact form factor and precise engineering, this adapter enables seamless integration without extensive redesign, offering an efficient solution for testing and prototyping electronic circuits.

Features:

Versatile Compatibility: Compatible with TSSOP8 and SSOP8 IC chips, expanding the range of compatible components for your project.

Pin Pitch Conversion: Converts the pin configuration of TSSOP8 and SSOP8 packages to fit the standard 0.65mm pitch of DIP footprints on PCBs.

Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.

Robust Construction: Crafted from high-quality materials, ensuring durability and reliability in demanding electronic applications.

Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.

Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.

Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.

Enhanced Connectivity: Provides reliable connections between the TSSOP8 or SSOP8 package and the DIP footprint, ensuring stable performance during testing and operation.

Applications:

Prototyping and development projects.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.

Specification

  • Material: PPS, Metal
  • Insulation Resistance: 1000mΩ Min, At DC 500V
  • Withstand Voltage: 700AC/1Minute
  • Contact Resistance: 25mΩ
  • PIN Root Elasticity: 55g / PIN (Normal)
  • Mechanical Life: 100000Times
  • Working Temperature: -65 - 155℃/149 - 311℉
  • Operating Force: Less than 0.9kg Max
  • Color: Green and Black

Features

  • Made of high-quality material, solid, durable, high strength, and good performance, long service life.
  • It adopts double contact technology, the contact is more stable (see the schematic below).
  • The shrapnel is made of imported beryllium copper material with low impedance and good elasticity.
  • The gold plating layer is thickened, the contact thickening plating, ultra-low contact resistance, and high reliability.
  • Adapter chip body width is 4.4mm; easy to operate, very convenient.

Specifications


S.No. Item PCB Size(mm) Pitch (mm) Pin Count Width(mm)
1 TSSOP/SSOP8 (4.4mm) 36*24 0.65 8 4.4
2 TSSOP/SSOP14 (4.4mm) 36*23 0.65 14 4.4
3 TSSOP/SSOP16 (4.4mm) 36*23 0.65 16 4.4
4 TSSOP/SSOP20 (4.4mm) 36*23 0.65 20 4.4
5 TSSOP/SSOP24 (4.4mm) 36*23 0.65 24 4.4
6 TSSOP/SSOP28 (4.4mm) 36*23 0.65 28 4.4
7 TSSOP/SSOP20 (5.3-5.7mm) 42*24 0.65 20 5.3-5.7
8 TSSOP/SSOP24 (5.3-5.7mm) 42*24 0.65 24 5.3-5.7
9 TSSOP/SSOP28 (5.3-5.7mm) 42*24 0.65 24 5.3-5.7

Product Parameter

Product Video

Package Includes

  • 1 x TSSOP/SSOP8 4.4mm Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm

Customer Reviews

Be the first to write a review
0%
(0)
0%
(0)
0%
(0)
0%
(0)
0%
(0)