Features:

Versatile Compatibility: Supports QFN32 and QFN40 SMD packages, broadening the range of compatible components for your project.

Pin Pitch Conversion: Converts the pin configuration of QFN32 and QFN40 packages with a 0.5mm pitch to fit the standard 2.54mm (0.1 inch) pitch of DIP footprints on PCBs.

Robust Construction: Constructed from high-quality materials, ensuring durability and reliability in demanding electronic applications.

Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.

Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.

Clear Markings: Clearly labeled pin assignments and package compatibility for easy identification and installation.

Enhanced Connectivity: Provides reliable connections between the QFN32 or QFN40 package and the DIP footprint, ensuring stable performance in diverse electronic systems.