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QFP80 DIP switch adapter plate 0.65mm pitch LQFP80 Block Block conversion

QFP80 DIP switch adapter plate 0.65mm pitch LQFP80 Block Block conversion_1

QFP80 DIP switch adapter plate 0.65mm pitch LQFP80 Block Block conversion_2

QFP80 DIP switch adapter plate 0.65mm pitch LQFP80 Block Block conversion

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Product SKU: KG438

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₹ 49 ~~₹ 69~~

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Specification

Description

A QFP80 DIP switch adapter plate with a 0.65mm pitch is a device designed to facilitate the conversion between two different types of integrated circuit (IC) packages: Quad Flat Package (QFP) and Dual In-Line Package (DIP).

Here's a breakdown of the key features and aspects of this adapter plate:

QFP80 Package Type: Stands for Quad Flat Package with 80 pins. QFP is a surface-mount IC package with pins extending from all four sides of the package.

DIP Switch Compatibility: The adapter plate incorporates Dual In-Line Package (DIP) switches. DIP switches are manual electronic switches that are mounted on a dual in-line package.

Pitch: The pitch refers to the distance between the center of one pin to the center of an adjacent pin. In this case, the pitch is 0.65mm, indicating the spacing between the pins of the QFP80 package.

Adapter Plate: The term "adapter plate" implies a physical board or plate-like structure designed to accommodate the QFP80 IC and facilitate its connection to a DIP socket or environment.

Conversion:

The primary function of the adapter plate is to convert the pin configuration and form factor of a QFP80 IC to that of a DIP package. This conversion is useful for compatibility with existing circuits or development boards that utilize DIP sockets.

LQFP80 Block Block: The term "LQFP80" likely refers to a Low-Profile Quad Flat Package with 80 pins. It's a variant of QFP with a lower profile, which may impact the overall dimensions of the adapter plate.

0.65mm Pitch: The 0.65mm pitch is a critical specification, indicating the precise distance between each pin on the QFP80 package. This pitch value is crucial for ensuring proper alignment and connectivity when adapting the IC to a DIP socket.

Specifications

S.No.	Item	Size(mm)	Front Pitch (mm)	Back Pitch (mm)	DIP (mm)
1	TQFP-32/44/48/64/84/100	46*38	0.5	0.8	2.54
2	QFN32/QFP32	40.6*20.2	0.65	0.8	2.54
3	QFP 32-144	55*55	0.5	0.8	2.54
4	TQFP 32-100	40*32	0.5	0.8	2.54
5	QFP 32/40/48/56/64	30*30	0.5	0.8	2.54
6	LQFP80	35.5*35.5	0.65	NA	2.54
7	LGA16 / QFN16	20.32*10.15	0.5	0.5	2.54
8	QFN20	25.7*12.4	0.5	0.65	2.54
9	QFN32/QFN40	40.64*15.24	0.5	0.5	2.54
10	QFN44/QFN48	25.4*25.4	0.5	0.5	2.54
11	QFN56/QFN64	33*33	0.5	0.5	2.54