SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm
![SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm-3]()
![SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm_1]()
![SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm]()
![SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm-3]()
![SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm_1]()
![SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm]()
Pin Pitch Conversion: Converts the pin configuration of SSOP16 and TSSOP16 packages to fit the standard 1.27mm pitch of DIP footprints on PCBs.
Wide Body Design: Specifically designed to accommodate IC chips with a wide body, ensuring a secure fit during testing and integration.
Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.
Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.
Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.
Compact Form Factor: Compact design minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.
Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.
Enhanced Connectivity: Provides reliable connections between the SSOP16 or TSSOP16 package and the DIP footprint, ensuring stable performance during testing and operation.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.
-37%
SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm
Available:Out of Stock
- Product SKU: KG909
₹ 399
₹ 638
Specification
Description
The SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter is engineered to simplify the testing and integration of SSOP16 and TSSOP16 (Shrink Small Outline Package/Thin Shrink Small Outline Package) IC chips with a wide body into existing circuit designs. With a pitch of 1.27mm and a width of 7.72mm, this adapter offers a practical solution tailored to accommodate IC chips with a wider body, ensuring compatibility and ease of use without necessitating extensive redesign.
Features:
Wide Compatibility: Compatible with SSOP16 and TSSOP16 IC chips featuring a wide body, expanding the range of compatible components for your project.Pin Pitch Conversion: Converts the pin configuration of SSOP16 and TSSOP16 packages to fit the standard 1.27mm pitch of DIP footprints on PCBs.
Wide Body Design: Specifically designed to accommodate IC chips with a wide body, ensuring a secure fit during testing and integration.
Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.
Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.
Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.
Compact Form Factor: Compact design minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.
Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.
Enhanced Connectivity: Provides reliable connections between the SSOP16 or TSSOP16 package and the DIP footprint, ensuring stable performance during testing and operation.
Applications:
IC chip testing and prototyping.Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.
Specifications
| S.No. | Item | PCB Size(mm) | Pitch (mm) | Pin Count | Width(mm) |
|---|---|---|---|---|---|
| 1 | SOP8 Narrow Body (150mil) | 23*20 | 1.27 | 8 | 3.81(150mil) |
| 2 | SOP8 Wide Body (200mil) | 22*20 | 1.27 | 8 | 5.08(200mil) |
| 3 | SOP14 Narrow Body (150mil) | 23*20 | 1.27 | 14 | 3.81(150mil) |
| 4 | SOP16 Narrow Body (150mil) | 23*20 | 1.27 | 16 | 3.81(150mil) |
| 5 | SOP16 Wide Body (300mil) | 35*36 | 1.27 | 16 | 7.72(300mil) |
| 6 | SOP18 Wide Body (300mil) | 27*25 | 1.27 | 18 | 7.72(300mil) |
| 7 | S0P20 Mid Body (200mil) | 27*24 | 1.27 | 20 | 5.08(200mil) |
| 8 | S0P20 Wide Body (300mil) | 35*26 | 1.27 | 20 | 7.72(300mil) |
| 9 | S0P24 Wide Body (300mil) | 35*26 | 1.27 | 24 | 7.72(300mil) |
| 10 | S0P28 Wide Body (300mil) | 35*26 | 1.27 | 28 | 7.72(300mil) |
Product Parameter
Product Video
Package Includes
- 1 x SSOP/TSSOP16 Wide Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 7.72mm
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