SSOP/TSSOP16 Narrow Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 3.81mm
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SSOP/TSSOP16 Narrow Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 3.81mm
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SSOP/TSSOP16 Narrow Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 3.81mm

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  • Product SKU: KG912
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Specification

Description

The SSOP/TSSOP16 Narrow Body Burn DIP Test Seat Patch IC Chip Adapter is specifically designed to simplify the testing and integration of SSOP16 and TSSOP16 (Shrink Small Outline Package/Thin Shrink Small Outline Package) IC chips with a narrow body into existing circuit designs. With a pitch of 1.27mm and a width of 3.81mm, this adapter provides a tailored solution to accommodate IC chips with a narrow body, ensuring compatibility and ease of use without necessitating extensive redesign.

Features:

Wide Compatibility: Compatible with SSOP16 and TSSOP16 IC chips featuring a narrow body, expanding the range of compatible components for your project.

Pin Pitch Conversion: Converts the pin configuration of SSOP16 and TSSOP16 packages to fit the standard 1.27mm pitch of DIP footprints on PCBs.

Narrow Body Design: Specifically designed to accommodate IC chips with a narrow body, ensuring a secure fit during testing and integration.

Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.

Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.

Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.

Compact Form Factor: Compact design minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.

Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.

Enhanced Connectivity: Provides reliable connections between the SSOP16 or TSSOP16 package and the DIP footprint, ensuring stable performance during testing and operation.

Applications:

IC chip testing and prototyping.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.

Specifications


S.No. Item PCB Size(mm) Pitch (mm) Pin Count Width(mm)
1 SOP8 Narrow Body (150mil) 23*20 1.27 8 3.81(150mil)
2 SOP8 Wide Body (200mil) 22*20 1.27 8 5.08(200mil)
3 SOP14 Narrow Body (150mil) 23*20 1.27 14 3.81(150mil)
4 SOP16 Narrow Body (150mil) 23*20 1.27 16 3.81(150mil)
5 SOP16 Wide Body (300mil) 35*36 1.27 16 7.72(300mil)
6 SOP18 Wide Body (300mil) 27*25 1.27 18 7.72(300mil)
7 S0P20 Mid Body (200mil) 27*24 1.27 20 5.08(200mil)
8 S0P20 Wide Body (300mil) 35*26 1.27 20 7.72(300mil)
9 S0P24 Wide Body (300mil) 35*26 1.27 24 7.72(300mil)
10 S0P28 Wide Body (300mil) 35*26 1.27 28 7.72(300mil)

Product Parameter

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Package Includes

  • 1 x SSOP/TSSOP16 Narrow Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 3.81mm

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