SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm
Review: 5 - "A masterpiece of literature" by John Doe, written onMay 4, 20020
Great

SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm

Available:In Stock
  • Product SKU: KG911
Wishlist
₹ 599 ₹ 899
Available offers
Best Rates

on Express Shipping – Hurry! Shipping starts from Rs69.

Tc
Free Shipping Offer -

Avail free shipping on all orders above Rs999.

Tc
Volume Discounts-

Buy More Save More! Discounts upto 20%. Contact us

Special Bulk Discounts

for colleges, Schools, Companies & resellers Contact us

Cash on Delivery

Available above Rs 499

Tc
Highlights
  • Original, High Quality
  • KitsGuru Warranty
Services
  • Email Support
  • Video Support to be purchased separately
Easy Payment Options
  • Netbanking
  • Debit/Credit cards
  • Cash on Delivery
  • E-wallets/UPI
Shipping Details
International Shipping
Available

  Need Volume Discounts? Deals are specially designed for you. Click here

  Need Customization? Provide us more details Click here

Warehouse Details   25G-151

Image
Secure

Specification

Description

The SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter is designed to streamline the testing and integration of SSOP20 and TSSOP20 (Shrink Small Outline Package/Thin Shrink Small Outline Package) IC chips with a mid-sized body into existing circuit designs. With a pitch of 1.27mm and a width of 5.08mm, this adapter offers a practical solution tailored to accommodate IC chips with a mid-sized body, ensuring compatibility and ease of use without necessitating extensive redesign.

Features:

Wide Compatibility: Compatible with SSOP20 and TSSOP20 IC chips featuring a mid-sized body, expanding the range of compatible components for your project.

Pin Pitch Conversion: Converts the pin configuration of SSOP20 and TSSOP20 packages to fit the standard 1.27mm pitch of DIP footprints on PCBs.

Mid-Sized Body Design: Specifically designed to accommodate IC chips with a mid-sized body, ensuring a secure fit during testing and integration.

Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.

Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.

Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.

Compact Form Factor: Compact design minimizes space requirements, making it suitable for various circuit designs and PCB layouts.

Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.

Enhanced Connectivity: Provides reliable connections between the SSOP20 or TSSOP20 package and the DIP footprint, ensuring stable performance during testing and operation.

Applications:

IC chip testing and prototyping.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.

Specifications


S.No. Item PCB Size(mm) Pitch (mm) Pin Count Width(mm)
1 SOP8 Narrow Body (150mil) 22*20 1.27 8 3.81(150mil)
2 SOP8 Wide Body (200mil) 22*20 1.27 8 5.08(200mil)
3 SOP14 Narrow Body (150mil) 22*20 1.27 14 3.81(150mil)
4 SOP16 Narrow Body (150mil) 35*25 1.27 16 3.81(150mil)
5 SOP16 Wide Body (200mil) 22*20 1.27 16 7.72(300mil)
6 SOP18 Wide Body (200mil) 25*25 1.27 18 7.72(300mil)
7 S0P20 Mid Body (200mil) 26*22 1.27 20 5.08(200mil)
8 S0P20 Wide Body (300mil) 34*25 1.27 20 7.72(300mil)
9 S0P24 Wide Body (300mil) 34*25 1.27 24 7.72(300mil)
10 S0P28 Wide Body (300mil) 34*25 1.27 28 7.72(300mil)

Product Parameter

Product Video

Package Includes

  • 1 x SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm

Customer Reviews

Be the first to write a review
0%
(0)
0%
(0)
0%
(0)
0%
(0)
0%
(0)