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SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm

SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm_1

SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm_2

SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm_3

SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter Pitch 1.27mm Width 5.08mm

Available:Out of Stock

Product SKU: KG911

Wishlist

₹ 599 ~~₹ 899~~

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Specification

Description

The SSOP/TSSOP20 Mid Body Burn DIP Test Seat Patch IC Chip Adapter is designed to streamline the testing and integration of SSOP20 and TSSOP20 (Shrink Small Outline Package/Thin Shrink Small Outline Package) IC chips with a mid-sized body into existing circuit designs. With a pitch of 1.27mm and a width of 5.08mm, this adapter offers a practical solution tailored to accommodate IC chips with a mid-sized body, ensuring compatibility and ease of use without necessitating extensive redesign.

Features:

Wide Compatibility: Compatible with SSOP20 and TSSOP20 IC chips featuring a mid-sized body, expanding the range of compatible components for your project.

Pin Pitch Conversion: Converts the pin configuration of SSOP20 and TSSOP20 packages to fit the standard 1.27mm pitch of DIP footprints on PCBs.

Mid-Sized Body Design: Specifically designed to accommodate IC chips with a mid-sized body, ensuring a secure fit during testing and integration.

Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.

Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.

Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.

Compact Form Factor: Compact design minimizes space requirements, making it suitable for various circuit designs and PCB layouts.

Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.

Enhanced Connectivity: Provides reliable connections between the SSOP20 or TSSOP20 package and the DIP footprint, ensuring stable performance during testing and operation.

Applications:

IC chip testing and prototyping.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.

Specifications

S.No.	Item	PCB Size(mm)	Pitch (mm)	Pin Count	Width(mm)
1	SOP8 Narrow Body (150mil)	22*20	1.27	8	3.81(150mil)
2	SOP8 Wide Body (200mil)	22*20	1.27	8	5.08(200mil)
3	SOP14 Narrow Body (150mil)	22*20	1.27	14	3.81(150mil)
4	SOP16 Narrow Body (150mil)	35*25	1.27	16	3.81(150mil)
5	SOP16 Wide Body (200mil)	22*20	1.27	16	7.72(300mil)
6	SOP18 Wide Body (200mil)	25*25	1.27	18	7.72(300mil)
7	S0P20 Mid Body (200mil)	26*22	1.27	20	5.08(200mil)
8	S0P20 Wide Body (300mil)	34*25	1.27	20	7.72(300mil)
9	S0P24 Wide Body (300mil)	34*25	1.27	24	7.72(300mil)
10	S0P28 Wide Body (300mil)	34*25	1.27	28	7.72(300mil)