Features:

Wide Compatibility: Compatible with SSOP24 and TSSOP24 IC chips, expanding the range of compatible components for your project.

Pin Pitch Conversion: Converts the pin configuration of SSOP24 and TSSOP24 packages to fit the standard 0.65mm pitch of DIP footprints on PCBs.

Body Width Compatibility: Accommodates IC chips with a body width of 5.3-5.7mm, ensuring a secure fit during testing and integration.

Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.

Robust Construction: Crafted from high-quality materials for durability and reliability in demanding electronic applications.

Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.

Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.

Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.

Enhanced Connectivity: Provides reliable connections between the SSOP24 or TSSOP24 package and the DIP footprint, ensuring stable performance during testing and operation.