SSOP/TSSOP8 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm
Pin Pitch Conversion: Converts the pin configuration of TSSOP8 and SSOP8 packages to fit the standard 0.65mm pitch of DIP footprints on PCBs.
Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.
Robust Construction: Crafted from high-quality materials, ensuring durability and reliability in demanding electronic applications.
Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.
Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.
Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.
Enhanced Connectivity: Provides reliable connections between the TSSOP8 or SSOP8 package and the DIP footprint, ensuring stable performance during testing and operation.
Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.
SSOP/TSSOP8 Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm
Available:In Stock
- Product SKU: KG899
₹ 499
₹ 899
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Warehouse Details
Specification
Description
This burn DIP test seat adapter is designed to facilitate the testing and integration of TSSOP8 and SSOP8 (Thin Shrink Small Outline Package/ Shrink Small Outline Package) IC chips into circuit designs. With a compact form factor and precise engineering, this adapter enables seamless integration without extensive redesign, offering an efficient solution for testing and prototyping electronic circuits.Features:
Versatile Compatibility: Compatible with TSSOP8 and SSOP8 IC chips, expanding the range of compatible components for your project.Pin Pitch Conversion: Converts the pin configuration of TSSOP8 and SSOP8 packages to fit the standard 0.65mm pitch of DIP footprints on PCBs.
Burn DIP Test Seat: Provides a secure and reliable test seat for burning and testing IC chips, ensuring accurate performance evaluation and troubleshooting.
Robust Construction: Crafted from high-quality materials, ensuring durability and reliability in demanding electronic applications.
Easy Integration: Simplifies the integration process, allowing for straightforward assembly onto PCBs without the need for specialized tools or expertise.
Compact Design: Compact form factor minimizes space requirements, making it suitable for compact circuit designs and densely populated PCB layouts.
Marked Pin Assignments: Clearly labeled pin assignments for easy identification and installation.
Enhanced Connectivity: Provides reliable connections between the TSSOP8 or SSOP8 package and the DIP footprint, ensuring stable performance during testing and operation.
Applications:
Prototyping and development projects.Circuit modifications and upgrades.
Board-level repairs and replacements.
DIY electronics and hobbyist applications.
Industrial and commercial electronic systems.
Specification
- Material: PPS, Metal
- Insulation Resistance: 1000mΩ Min, At DC 500V
- Withstand Voltage: 700AC/1Minute
- Contact Resistance: 25mΩ
- PIN Root Elasticity: 55g / PIN (Normal)
- Mechanical Life: 100000Times
- Working Temperature: -65 - 155℃/149 - 311℉
- Operating Force: Less than 0.9kg Max
- Color: Green and Black
Features
- Made of high-quality material, solid, durable, high strength, and good performance, long service life.
- It adopts double contact technology, the contact is more stable (see the schematic below).
- The shrapnel is made of imported beryllium copper material with low impedance and good elasticity.
- The gold plating layer is thickened, the contact thickening plating, ultra-low contact resistance, and high reliability.
- Adapter chip body width is 4.4mm; easy to operate, very convenient.
Specifications
S.No. | Item | PCB Size(mm) | Pitch (mm) | Pin Count | Width(mm) |
---|---|---|---|---|---|
1 | TSSOP/SSOP8 (4.4mm) | 36*24 | 0.65 | 8 | 4.4 |
2 | TSSOP/SSOP14 (4.4mm) | 36*23 | 0.65 | 14 | 4.4 |
3 | TSSOP/SSOP16 (4.4mm) | 36*23 | 0.65 | 16 | 4.4 |
4 | TSSOP/SSOP20 (4.4mm) | 36*23 | 0.65 | 20 | 4.4 |
5 | TSSOP/SSOP24 (4.4mm) | 36*23 | 0.65 | 24 | 4.4 |
6 | TSSOP/SSOP28 (4.4mm) | 36*23 | 0.65 | 28 | 4.4 |
7 | TSSOP/SSOP20 (5.3-5.7mm) | 42*24 | 0.65 | 20 | 5.3-5.7 |
8 | TSSOP/SSOP24 (5.3-5.7mm) | 42*24 | 0.65 | 24 | 5.3-5.7 |
9 | TSSOP/SSOP28 (5.3-5.7mm) | 42*24 | 0.65 | 24 | 5.3-5.7 |
Product Parameter
Product Video
Package Includes
- 1 x TSSOP/SSOP8 4.4mm Burn DIP Test Seat Patch IC Chip Adapter Pitch 0.65mm